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APPLICATIONS |
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Back Plane for Network or Server
Wafer Probe Card
Key Technology : Pulse plating / Compliant pin / impedance
/ Edge Plating / Counter Bore |
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SPECFICATIONS |
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| Items |
2002 |
2003 |
2004 |
| Layer |
34 L |
40 L |
50 L |
| Board Thickness |
6.4 mm |
8.0 mm |
10.0 mm |
| Board Size |
850 X 610
mm |
900 X 700
mm |
900 X 700
mm |
| Min. Drill Size |
0.55 mm |
~ 0.4 mm |
~ 0.3 mm |
| Aspect Ratio |
8 ~ 12 |
~ 14 |
~ 16 |
| Impedance |
+ - 10 % |
+ - 10 % |
+ - 8% |
| Material |
High Tg ( over
180กษ ) FR-4
GETEK ( Megtron )
or Equivalent
Low Dk / Df Material Available |
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