- Wired Network
- Probe Card
- Optical Module
Wired network is a PCB that is applied to the switch/router that is used to connect a device such as laptop or desktop to the Internet or other networks using a cable. The most common form of wired network is using a cable, connecting one end of the cable to the Ethernet port of a network router, and the other end to a computer or other device.
Back DrillingBack drilling is a manufacturing method designed to minimize the loss of high-speed signal that passes through PTH by eliminating non-essential points.
Double DrillingDrilling requires high processing precision as a method of processing PTH at the same point using bits of the same specification.
The processing method of drilling is important to increase the PTH processing precision for high AR products.
High Aspect RatioIt is gradually increasing in order to enable high-speed transmission of high-capacity data.
Category Details Material Ultra Low Dk/Df Layer 30L Thickness 5.0T DHS (Min.) 0.225Φ Aspect Ratio 22:1 D2M 6mil
Probe card is a tool that is used to inspect the silicone wafer in the pre-processing stage of LSI manufacturing. It consists of a set of probe pins (probe pins/probe needles) elaborately assembled on top of a circular PCB.
DrillingDrilling is an important technical method applied to ultra-multilayer products. A special drilling method is applied to ultra-multilayer products over 6.0 T, and it requires high precision.
High Aspect RatioIt requires multilayer technology for electrical performance.
Category Details Layer 116L Thickness 7.4T DHS (Min.) 0.2Φ Aspect Ratio 37:1 Pitch 0.65㎜ Surface Finish ENIG
Optical module generally refers to a PCB that is used in the plug-in transceiver designed for broadband data communication.
An optical module generally consists of an interface, which is applied to the connecting part inside the system, and a plug-in module, which is applied to the fiber optic cable.
4+N+4 Structure4+N+4 structure uses the LVH buildup structure for high-speed signal transmission, and requires the registration technology to prevent tilting of LVH in each layer, and a high level of reliability to prevent the separation of the LVH interface.